Kjøpe MC44BS373CAEF med BYCHPS
Kjøp med garanti
MC44BS373CAEF
- Delenummer:
- MC44BS373CAEF
- Produsent:
- NXP Semiconductors / Freescale
- Beskrivelse:
- AUDIO VIDEO INTERGRATION MOD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18483 Pieces
- Dataark:
- MC44BS373CAEF.pdf
Introduksjon
BYCHIPS er strømprodusenten for MC44BS373CAEF, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MC44BS373CAEF via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | NTSC/PAL Modulator |
|---|---|
| Leverandør Enhetspakke: | 16-SOIC |
| Serie: | - |
| emballasje: | Tube |
| Pakke / tilfelle: | 16-SOIC (0.154", 3.90mm Width) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | MC44BS373CAEF |
| Utvidet beskrivelse: | NTSC/PAL Modulator IC Audio/Video, VCR's, Set-Top Boxes 16-SOIC |
| Beskrivelse: | AUDIO VIDEO INTERGRATION MOD |
| applikasjoner: | Audio/Video, VCR's, Set-Top Boxes |
| Email: | [email protected] |
Beslektede deler til MC44BS373CAEF
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MC44BS373CAFCR2 | NXP USA Inc. | IC MODULATOR AUD/VID U/V 20-QFN | Forespørsel |
|
MC44BS374T1EFR2 | NXP USA Inc. | IC AUDIO/VIDEO MODULATOR 16-SOIC | Forespørsel |
|
MC44BS373CAD | NXP USA Inc. | AUDIO VIDEO INTERGRATION MOD | Forespørsel |
|
MC44BS374T1EF | NXP USA Inc. | IC AUDIO/VIDEO MODULATOR 16-SOIC | Forespørsel |
|
MC44BS373CAFC | NXP USA Inc. | IC MODULATOR AUD/VID U/V 20-QFN | Forespørsel |
|
MC44BS373CAEFR2 | NXP USA Inc. | IC AUD/VID PAL MODULATOR 16-SOIC | Forespørsel |
|
MC44BS374T1AEFR2 | NXP USA Inc. | IC AUDIO/VIDEO MODULATOR 16-SOIC | Forespørsel |
|
MC44BS374T1AEF | NXP USA Inc. | IC AUDIO/VIDEO MODULATOR 16-SOIC | Forespørsel |
|
MC44BS374CAEFR2 | NXP USA Inc. | IC AUDIO/VIDEO MODULATOR 16-SOIC | Forespørsel |
|
MC44BS374CAEF | NXP USA Inc. | IC AUDIO/VIDEO MODULATOR 16-SOIC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers