Kjøpe MC74AC4040MELG med BYCHPS
Kjøp med garanti
MC74AC4040MELG
- Delenummer:
- MC74AC4040MELG
- Produsent:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- IC COUNTER RIPPLE 12ST 16-SOEIAJ
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13132 Pieces
- Dataark:
- MC74AC4040MELG.pdf
Introduksjon
BYCHIPS er strømprodusenten for MC74AC4040MELG, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MC74AC4040MELG via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2 V ~ 6 V |
|---|---|
| Trigger Type: | Negative Edge |
| timing: | - |
| Leverandør Enhetspakke: | 16-SOEIAJ |
| Serie: | 74AC |
| tilbakestille: | Asynchronous |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 16-SOIC (0.209", 5.30mm Width) |
| Andre navn: | MC74AC4040MELG-ND MC74AC4040MELGOSTR |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall elementer: | 1 |
| Antall bit per element: | 12 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | MC74AC4040MELG |
| Logikk Type: | Binary Counter |
| Utvidet beskrivelse: | Counter IC Binary Counter Element 12 Bit Negative Edge 16-SOEIAJ |
| Retning: | Up |
| Beskrivelse: | IC COUNTER RIPPLE 12ST 16-SOEIAJ |
| Count Rate: | 140MHz |
| Email: | [email protected] |
Beslektede deler til MC74AC4040MELG
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MC74AC4040N | ON Semiconductor | IC COUNTER RIPPLE 12ST 16-DIP | Forespørsel |
|
MC74AC4040NG | ON Semiconductor | IC COUNTER RIPPLE 12ST 16-DIP | Forespørsel |
|
MC74AC4040D | ON Semiconductor | IC COUNTER RIPPLE 12ST 16-SOIC | Forespørsel |
|
MC74AC4040DG | ON Semiconductor | IC COUNTER RIPPLE 12ST 16-SOIC | Forespørsel |
|
MC74AC4040DR2G | ON Semiconductor | IC COUNTER RIPPLE 12ST 16-SOIC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers