Kjøpe MDB1900ZCQZ med BYCHPS
Kjøp med garanti
MDB1900ZCQZ
- Delenummer:
- MDB1900ZCQZ
- Produsent:
- Micrel / Microchip Technology
- Beskrivelse:
- BUFFER 19-OUTPUT
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16042 Pieces
- Dataark:
- MDB1900ZCQZ.pdf
Introduksjon
BYCHIPS er strømprodusenten for MDB1900ZCQZ, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MDB1900ZCQZ via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.375 V ~ 3.465 V |
|---|---|
| Leverandør Enhetspakke: | 72-QFN (10x10) |
| Serie: | - |
| Forhold - Input: Output: | 1:19 |
| emballasje: | Tray |
| Pakke / tilfelle: | 72-VFQFN Exposed Pad |
| PLL: | Yes |
| Produksjon: | HCSL |
| Driftstemperatur: | 0°C ~ 70°C |
| Antall kretser: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | MDB1900ZCQZ |
| Hovedhensikt: | PCI Express (PCIe), SATA CPU |
| Input: | HCSL |
| Frekvens - Maks: | 133.33MHz |
| Differensial - Input: Output: | Yes/Yes |
| Beskrivelse: | BUFFER 19-OUTPUT |
| Email: | [email protected] |
Beslektede deler til MDB1900ZCQZ
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MDB1900ZBQY-TR | Microchip Technology | IC ZERO DELAY BUFFER 72VQFN | Forespørsel |
|
MDB1900ZBQZ | Microchip Technology | BUFFER 19-OUTPUT | Forespørsel |
|
MDB1900ZBQY | Microchip Technology | IC ZERO DELAY BUFFER 72VQFN | Forespørsel |
|
MDB1900ZCQZ-TR | Microchip Technology | BUFFER 19-OUTPUT | Forespørsel |
|
MDB1900ZBQZ-TR | Microchip Technology | BUFFER 19-OUTPUT | Forespørsel |
|
MDB1900ZCQY | Microchip Technology | IC ZERO DELAY BUFFER 72VQFN | Forespørsel |
|
MDB1900ZCQY-TR | Microchip Technology | IC ZERO DELAY BUFFER 72VQFN | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers