Kjøpe MEC1609I-PZP med BYCHPS
Kjøp med garanti
MEC1609I-PZP
- Delenummer:
- MEC1609I-PZP
- Produsent:
- Micrel / Microchip Technology
- Beskrivelse:
- MIXED SIGNAL MOBILE EMBEDDED CON
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19282 Pieces
- Dataark:
- MEC1609I-PZP.pdf
Introduksjon
BYCHIPS er strømprodusenten for MEC1609I-PZP, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MEC1609I-PZP via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3.3V |
|---|---|
| Leverandør Enhetspakke: | 144-LFBGA (10x10) |
| Serie: | - |
| RAM-størrelse: | 16KB |
| Programminnetype: | FLASH (192 kB) |
| emballasje: | Tube |
| Pakke / tilfelle: | 144-LFBGA |
| Driftstemperatur: | -40°C ~ 85°C |
| Antall I / O: | 115 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | MEC1609I-PZP |
| Interface: | ACPI, BC-Link, I²C/SMBus, LPC, PECI, PS/2, SPI, VLPC |
| Beskrivelse: | MIXED SIGNAL MOBILE EMBEDDED CON |
| Kjerneprosessor: | ARC-625D |
| Controller Series: | - |
| applikasjoner: | I/O Controller |
| Email: | [email protected] |
Beslektede deler til MEC1609I-PZP
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MEC1632-AUE | Microchip Technology | IC EMBEDDED CTLR | Forespørsel |
|
MEC1609-PZV | Microchip Technology | IC EMBEDDED CTLR 144TFBGA | Forespørsel |
 |
CP3BT26Y98AWHX/NOPB | Texas Instruments | IC CPU BLUETOOH CAN | Forespørsel |
|
MEC1609-PZP | Microchip Technology | IC EMBEDDED CTLR | Forespørsel |
 |
XE8805AMI028LF | Semtech Corporation | IC DAS 16BIT FLASH 8K MTP 64LQFP | Forespørsel |
|
MEC1633X-AUE | Microchip Technology | IC EMBEDDED CTLR 169LFBGA | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog