Kjøpe MG06400D-BN1MM med BYCHPS
Kjøp med garanti
MG06400D-BN1MM
- Delenummer:
- MG06400D-BN1MM
- Produsent:
- Littelfuse
- Beskrivelse:
- IGBT MODULE PACKAGE D 600V 400A
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19999 Pieces
- Dataark:
- MG06400D-BN1MM.pdf
Introduksjon
BYCHIPS er strømprodusenten for MG06400D-BN1MM, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MG06400D-BN1MM via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.45V @ 15V, 400A |
| Leverandør Enhetspakke: | D3 |
| Serie: | - |
| Strøm - Maks: | 1400W |
| Pakke / tilfelle: | D-3 Module |
| Andre navn: | F6284 |
| Driftstemperatur: | - |
| NTC-termistor: | No |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | MG06400D-BN1MM |
| Input Kapasitans (Cies) @ Vce: | 18nF @ 25V |
| Input: | Standard |
| IGBT Type: | - |
| Utvidet beskrivelse: | IGBT Module Half Bridge 600V 460A 1400W Chassis Mount D3 |
| Beskrivelse: | IGBT MODULE PACKAGE D 600V 400A |
| Gjeldende - Samler Cutoff (Maks): | 1mA |
| Nåværende - Samler (Ic) (Maks): | 460A |
| konfigurasjon: | Half Bridge |
| Email: | [email protected] |
Beslektede deler til MG06400D-BN1MM
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
FMS6G20US60S | Fairchild/ON Semiconductor | IGBT 600V 20A 25PM-AA | Forespørsel |
 |
APTGF25H120T2G | Microsemi Corporation | MOD IGBT NPT 1200V 40V SP2 | Forespørsel |
 |
MG06400D-BN4MM | Littelfuse Inc. | IGBT 600V 500A 1250W PKG D | Forespørsel |
 |
GHIS040A060S-A1 | Global Power Technologies Group | IGBT BOOST CHOP 600V 80A SOT227 | Forespørsel |
|
APTGF150DH120G | Microsemi Corporation | IGBT MODULE NPT ASYM BRIDGE SP6 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog