Kjøpe MIO1200-33E11 med BYCHPS
Kjøp med garanti
MIO1200-33E11
- Delenummer:
- MIO1200-33E11
- Produsent:
- IXYS Corporation
- Beskrivelse:
- IGBT MODULE SGL 1200A E11
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15962 Pieces
- Dataark:
- MIO1200-33E11.pdf
Introduksjon
BYCHIPS er strømprodusenten for MIO1200-33E11, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MIO1200-33E11 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 3300V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 3.1V @ 15V, 1200A |
| Leverandør Enhetspakke: | E11 |
| Serie: | - |
| Strøm - Maks: | - |
| Pakke / tilfelle: | E11 |
| Driftstemperatur: | -40°C ~ 125°C (TJ) |
| NTC-termistor: | No |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | MIO1200-33E11 |
| Input Kapasitans (Cies) @ Vce: | - |
| Input: | Standard |
| IGBT Type: | NPT |
| Utvidet beskrivelse: | IGBT Module NPT Single Switch 3300V 1200A Chassis Mount E11 |
| Beskrivelse: | IGBT MODULE SGL 1200A E11 |
| Gjeldende - Samler Cutoff (Maks): | 120mA |
| Nåværende - Samler (Ic) (Maks): | 1200A |
| konfigurasjon: | Single Switch |
| Email: | [email protected] |
Beslektede deler til MIO1200-33E11
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MWI25-12A7 | IXYS | MOD IGBT SIXPACK RBSOA 1200V E2 | Forespørsel |
|
MIO1200-25E10 | IXYS | MOD IGBT SGL SWITCH 2500V E10 | Forespørsel |
|
MIO1200-33E10 | IXYS | MOD IGBT SGL SWITCH 3300V E10 | Forespørsel |
 |
APTGLQ300H65G | Microsemi Corporation | PWR MOD IGBT4 650V 600A SP6 | Forespørsel |
 |
IRGTI090U06 | Infineon Technologies | IGBT MOD HALF BRIDGE 90A UFAST | Forespørsel |
|
FZ1000R12KF5NDSA1 | Infineon Technologies | IGBT MODULE 1200V 1000A | Forespørsel |
|
APTGT200H60G | Microsemi Corporation | IGBT MOD TRENCH FULL BRIDGE SP6 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog