Kjøpe MIXA20W1200TML med BYCHPS
Kjøp med garanti
MIXA20W1200TML
- Delenummer:
- MIXA20W1200TML
- Produsent:
- IXYS Corporation
- Beskrivelse:
- IGBT MODULE 1200V 20A HEX
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12570 Pieces
- Dataark:
- MIXA20W1200TML.pdf
Introduksjon
BYCHIPS er strømprodusenten for MIXA20W1200TML, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MIXA20W1200TML via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 1200V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.1V @ 15V, 16A |
| Leverandør Enhetspakke: | E1 |
| Serie: | - |
| Strøm - Maks: | 100W |
| Pakke / tilfelle: | E1 |
| Driftstemperatur: | -40°C ~ 125°C (TJ) |
| NTC-termistor: | Yes |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | MIXA20W1200TML |
| Input Kapasitans (Cies) @ Vce: | - |
| Input: | Standard |
| IGBT Type: | PT |
| Utvidet beskrivelse: | IGBT Module PT Three Phase Inverter 1200V 28A 100W Chassis Mount E1 |
| Beskrivelse: | IGBT MODULE 1200V 20A HEX |
| Gjeldende - Samler Cutoff (Maks): | 100µA |
| Nåværende - Samler (Ic) (Maks): | 28A |
| konfigurasjon: | Three Phase Inverter |
| Email: | [email protected] |
Beslektede deler til MIXA20W1200TML
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MIXA20WB1200TMH | IXYS | IGBT MODULE 1200V 20A HEX | Forespørsel |
|
MIXA225PF1200TSF | IXYS | IGBT MODULE 1200V 250A | Forespørsel |
|
MIXA20W1200TMH | IXYS | IGBT MODULE 1200V 28A HEX | Forespørsel |
|
MIXA20W1200MC | IXYS | IGBT MODULE 1200V 20A HEX | Forespørsel |
|
MIXA225RF1200TSF | IXYS | IGBT MODULE 1200V 250A | Forespørsel |
|
MIXA20WB1200TML | IXYS | IGBT MODULE 1200V 20A HEX | Forespørsel |
|
MIXA20WB1200TED | IXYS | IGBT MODULE 1200V 20A HEX | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers