Kjøpe MLVB06V18C003 med BYCHPS
Kjøp med garanti
MLVB06V18C003
- Delenummer:
- MLVB06V18C003
- Produsent:
- Bussmann (Eaton)
- Beskrivelse:
- VARISTOR 28V 0603
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17451 Pieces
- Dataark:
- MLVB06V18C003.pdf
Introduksjon
BYCHIPS er strømprodusenten for MLVB06V18C003, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MLVB06V18C003 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Varistor Spenning (Typ): | 28V |
|---|---|
| Varistor Spenning (Min): | 22V |
| Varistor Spenning (Maks): | 34V |
| Serie: | MLVB |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 0603 (1608 Metric) |
| Andre navn: | 283-3005-2 |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antall kretser: | 1 |
| Monteringstype: | Surface Mount, MLCV |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Maksimal likestrøm: | 18VDC |
| Maks. Vekselstrøm: | - |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | MLVB06V18C003 |
| Energi: | - |
| Beskrivelse: | VARISTOR 28V 0603 |
| Kapasitans @ Frekvens: | 3pF @ 1MHz |
| Email: | [email protected] |
Beslektede deler til MLVB06V18C003
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
V22ZS1PX2855 | Littelfuse Inc. | VARISTOR 22V 250A DISC 7MM | Forespørsel |
 |
MLVB06V18C0R5 | Eaton | VARISTOR 105V 0603 | Forespørsel |
|
MLVB06V18C001 | Eaton | VARISTOR 53V 0603 | Forespørsel |
 |
MLVB04V18C001 | Eaton | VARISTOR 53V 0402 | Forespørsel |
|
MLVB04V18C0R5 | Eaton | VARISTOR 105V 0402 | Forespørsel |
|
MLVB04V09C005 | Eaton | VARISTOR 14V 0402 | Forespørsel |
 |
V20E275 | Littelfuse Inc. | VARISTOR 430V 10KA DISC 20MM | Forespørsel |
|
MLVB04V18C003 | Eaton | VARISTOR 28V 0402 | Forespørsel |
|
MLVB06V09C005 | Eaton | VARISTOR 14V 0603 | Forespørsel |
 |
2838199 | Phoenix Contact | VARISTOR MODULE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers