Kjøpe MPLC0730L3R3 med BYCHPS
Kjøp med garanti
MPLC0730L3R3
- Delenummer:
- MPLC0730L3R3
- Produsent:
- KEMET
- Beskrivelse:
- FIXED IND 3.3UH 5.7A 30 MOHM SMD
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13347 Pieces
- Dataark:
- MPLC0730L3R3.pdf
Introduksjon
BYCHIPS er strømprodusenten for MPLC0730L3R3, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MPLC0730L3R3 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±20% |
| Leverandør Enhetspakke: | - |
| Størrelse / Dimensjon: | 0.315" L x 0.264" W (8.00mm x 6.70mm) |
| skjerming: | Unshielded |
| Serie: | MPLC |
| rangeringer: | - |
| Q @ Freq: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Nonstandard |
| Andre navn: | 399-10988-2 |
| Driftstemperatur: | -20°C ~ 120°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | - |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | MPLC0730L3R3 |
| induktans: | 3.3µH |
| Høyde - sittende (maks): | 0.118" (3.00mm) |
| Frekvens - Test: | 100kHz |
| Frekvens - Selvresonans: | - |
| Utvidet beskrivelse: | 3.3µH Unshielded Wirewound Inductor 5.7A 30 mOhm Max Nonstandard |
| Beskrivelse: | FIXED IND 3.3UH 5.7A 30 MOHM SMD |
| DC-motstand (DCR): | 30 mOhm Max |
| Nåværende vurdering: | 5.7A |
| Nåværende - Metning: | 6.5A |
| Email: | [email protected] |
Beslektede deler til MPLC0730L3R3
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MPLC0730L2R2 | KEMET | FIXED IND 2.2UH 7.3A 19 MOHM SMD | Forespørsel |
|
MPLC0730L1R0 | KEMET | FIXED IND 1UH 10.6A 9 MOHM SMD | Forespørsel |
|
MPLC0730LR75 | KEMET | FIXED IND 750NH SMD | Forespørsel |
 |
MPLC0730L1R5 | KEMET | FIXED IND 1.5UH 8.6A 15 MOHM SMD | Forespørsel |
|
MPLC0730L4R7 | KEMET | FIXED IND 4.7UH 5A 41 MOHM SMD | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers