Kjøpe MR25H256CDF med BYCHPS
Kjøp med garanti
MR25H256CDF
- Delenummer:
- MR25H256CDF
- Produsent:
- EverSpin Technologies, Inc.
- Beskrivelse:
- IC MRAM 256KBIT 40MHZ 8DFN
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13883 Pieces
- Dataark:
- MR25H256CDF.pdf
Introduksjon
BYCHIPS er strømprodusenten for MR25H256CDF, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MR25H256CDF via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.7 V ~ 3.6 V |
|---|---|
| Leverandør Enhetspakke: | 8-DFN-EP, Small Flag (5x6) |
| Hastighet: | 40MHz |
| Serie: | - |
| emballasje: | Tray |
| Pakke / tilfelle: | 8-VDFN Exposed Pad |
| Andre navn: | 819-1038 |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Minnetype: | Non-Volatile |
| Minnestørrelse: | 256Kb (32K x 8) |
| Minneformat: | RAM |
| Produsentens Standard Lead Time: | 14 Weeks |
| Produsentens varenummer: | MR25H256CDF |
| Interface: | SPI Serial |
| Beskrivelse: | IC MRAM 256KBIT 40MHZ 8DFN |
| Email: | [email protected] |
Beslektede deler til MR25H256CDF
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MR25H256MDF | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Forespørsel |
 |
MR25H256MDC | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Forespørsel |
|
MR25H256MDCR | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Forespørsel |
|
MR25H256CDCR | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Forespørsel |
|
MR25H256CDFR | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Forespørsel |
|
MR25H256CDC | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Forespørsel |
|
MR25H256MDFR | Everspin Technologies Inc. | IC MRAM 256KBIT 40MHZ 8DFN | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers