Kjøpe MRF327 med BYCHPS
Kjøp med garanti
MRF327
- Delenummer:
- MRF327
- Produsent:
- Aeroflex (MACOM Technology Solutions)
- Beskrivelse:
- TRANS RF NPN 33V 9A 316-01
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14450 Pieces
- Dataark:
- MRF327.pdf
Introduksjon
BYCHIPS er strømprodusenten for MRF327, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MRF327 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 33V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Enhetspakke: | 316-01, STYLE 1 |
| Serie: | - |
| Strøm - Maks: | 80W |
| emballasje: | Tray |
| Pakke / tilfelle: | 316-01 |
| Andre navn: | 1465-1181 |
| Driftstemperatur: | - |
| Støy Figur (dB Typ @ f): | - |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | MRF327 |
| Gevinst: | 9dB |
| Frekvens - Overgang: | - |
| Utvidet beskrivelse: | RF Transistor NPN 33V 9A 80W Chassis Mount 316-01, STYLE 1 |
| Beskrivelse: | TRANS RF NPN 33V 9A 316-01 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 4A, 5V |
| Nåværende - Samler (Ic) (Maks): | 9A |
| Email: | [email protected] |
Beslektede deler til MRF327
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BFP 720F E6327 | Infineon Technologies | TRANS RF NPN 45GHZ 4.7V TSFP4 | Forespørsel |
 |
MRF323 | M/A-Com Technology Solutions | TRANS RF NPN 33V 1.1A 244-04 | Forespørsel |
 |
PN5179_D27Z | Fairchild/ON Semiconductor | TRANS RF NPN 12V 50MA TO-92 | Forespørsel |
|
MRF321 | M/A-Com Technology Solutions | TRANS RF NPN 33V 1.1A 244-04 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers