Kjøpe MRF6S18140HR3 med BYCHPS
Kjøp med garanti
MRF6S18140HR3
- Delenummer:
- MRF6S18140HR3
- Produsent:
- NXP Semiconductors / Freescale
- Beskrivelse:
- FET RF 68V 1.88GHZ NI880
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18985 Pieces
- Dataark:
- MRF6S18140HR3.pdf
Introduksjon
BYCHIPS er strømprodusenten for MRF6S18140HR3, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MRF6S18140HR3 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Test: | 28V |
|---|---|
| Spenningsvurdering: | 68V |
| Transistor Type: | LDMOS |
| Leverandør Enhetspakke: | NI-880 |
| Serie: | - |
| Power - Output: | 29W |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | NI-880 |
| Støy Figur: | - |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | MRF6S18140HR3 |
| Gevinst: | 16dB |
| Frekvens: | 1.88GHz |
| Utvidet beskrivelse: | RF Mosfet LDMOS 28V 1.2A 1.88GHz 16dB 29W NI-880 |
| Beskrivelse: | FET RF 68V 1.88GHZ NI880 |
| Nåværende vurdering: | - |
| Nåværende - Test: | 1.2A |
| Email: | [email protected] |
Beslektede deler til MRF6S18140HR3
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MRF6S18100NR1 | NXP USA Inc. | FET RF 68V 1.99GHZ TO2704 | Forespørsel |
 |
MRF6S18140HSR3 | NXP USA Inc. | FET RF 68V 1.88GHZ NI880S | Forespørsel |
|
MRF6S18140HSR5 | NXP USA Inc. | FET RF 68V 1.88GHZ NI880S | Forespørsel |
 |
MRF6S19140HR3 | NXP USA Inc. | FET RF 68V 1.99GHZ NI-880 | Forespørsel |
|
MRF6S18140HR5 | NXP USA Inc. | FET RF 68V 1.88GHZ NI880 | Forespørsel |
 |
MRF6S18100NBR1 | NXP USA Inc. | FET RF 68V 1.99GHZ TO2724 | Forespørsel |
|
MRF6S18060NBR1 | NXP USA Inc. | FET RF 68V 1.99GHZ TO272-4 | Forespørsel |
|
MRF6S18060NR1 | NXP USA Inc. | FET RF 68V 1.99GHZ TO270-4 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers