Kjøpe MRS10KBF med BYCHPS
Kjøp med garanti
MRS10KBF
- Delenummer:
- MRS10KBF
- Produsent:
- AMP Connectors / TE Connectivity
- Beskrivelse:
- RES ARRAY 4 RES 10K OHM 1206
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16124 Pieces
- Dataark:
- MRS10KBF.pdf
Introduksjon
BYCHIPS er strømprodusenten for MRS10KBF, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MRS10KBF via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | ±0.1% |
|---|---|
| Temperaturkoeffisient: | ±25ppm/°C |
| Leverandør Enhetspakke: | - |
| Størrelse / Dimensjon: | 0.126" L x 0.063" W (3.20mm x 1.60mm) |
| Serie: | MRS, Holsworthy |
| Motstand (ohm): | 10k |
| Kraft per element: | 62.5mW |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 1206 (3216 Metric), Convex, Long Side Terminals |
| Andre navn: | 1624122-1 1624122-1-ND MRS10KB |
| Driftstemperatur: | -55°C ~ 155°C |
| Antall motstandere: | 4 |
| Antall pinner: | 8 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 13 Weeks |
| Produsentens varenummer: | MRS10KBF |
| Høyde - sittende (maks): | 0.026" (0.65mm) |
| Utvidet beskrivelse: | 10k Ohm ±0.1% 62.5mW Power Per Element Isolated Resistor Network/Array ±25ppm/°C 1206 (3216 Metric), Convex, Long Side Terminals |
| Beskrivelse: | RES ARRAY 4 RES 10K OHM 1206 |
| Kretskort: | Isolated |
| applikasjoner: | Voltage Divider (TCR Matched) |
| Email: | [email protected] |
Beslektede deler til MRS10KBF
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers