Kjøpe MS1261 med BYCHPS
Kjøp med garanti
MS1261
- Delenummer:
- MS1261
- Produsent:
- Microsemi
- Beskrivelse:
- TRANS RF BIPO 34W 2.5A M122
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19967 Pieces
- Dataark:
- MS1261.pdf
Introduksjon
BYCHIPS er strømprodusenten for MS1261, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MS1261 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 18V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Enhetspakke: | M122 |
| Serie: | - |
| Strøm - Maks: | 34W |
| emballasje: | Bulk |
| Pakke / tilfelle: | M122 |
| Driftstemperatur: | 200°C (TJ) |
| Støy Figur (dB Typ @ f): | - |
| Monteringstype: | Chassis, Stud Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | MS1261 |
| Gevinst: | 12dB |
| Frekvens - Overgang: | 175MHz |
| Utvidet beskrivelse: | RF Transistor NPN 18V 2.5A 175MHz 34W Chassis, Stud Mount M122 |
| Beskrivelse: | TRANS RF BIPO 34W 2.5A M122 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 250mA, 5V |
| Nåværende - Samler (Ic) (Maks): | 2.5A |
| Email: | [email protected] |
Beslektede deler til MS1261
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
2SC5455-A | CEL | RF TRANSISTOR NPN SOT-143 | Forespørsel |
 |
MCH4009-TL-H | ON Semiconductor | TRANS NPN 3.5V 40MA MCPH4 | Forespørsel |
 |
BFG425W,135 | NXP USA Inc. | TRANS RF NPN 25GHZ 4.5V SOT343R | Forespørsel |
 |
MT3S20P(TE12L,F) | Toshiba Semiconductor and Storage | TRANS RF NPN 12V 1GHZ PW-MINI | Forespørsel |
 |
MRF586G | Microsemi Corporation | TRANS BIPO NPN TO-39 | Forespørsel |
 |
AT-41486-BLKG | Broadcom Limited | TRANS SIL LOW NOISE BIPOL 45MD | Forespørsel |
 |
AT-32011-BLKG | Broadcom Limited | TRANS NPN BIPO 5.5V 32MA SOT-143 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers