Kjøpe MWI150-06A8 med BYCHPS
Kjøp med garanti
MWI150-06A8
- Delenummer:
- MWI150-06A8
- Produsent:
- IXYS Corporation
- Beskrivelse:
- TRANS 16BIY 3-PH 600V 115AMP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 18568 Pieces
- Dataark:
- MWI150-06A8.pdf
Introduksjon
BYCHIPS er strømprodusenten for MWI150-06A8, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MWI150-06A8 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.5V @ 15V, 150A |
| Leverandør Enhetspakke: | E3 |
| Serie: | - |
| Strøm - Maks: | 515W |
| Pakke / tilfelle: | E3 |
| Andre navn: | Q2256181 |
| Driftstemperatur: | -40°C ~ 125°C (TJ) |
| NTC-termistor: | No |
| Monteringstype: | Chassis Mount |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | MWI150-06A8 |
| Input Kapasitans (Cies) @ Vce: | 6.5nF @ 25V |
| Input: | Standard |
| IGBT Type: | NPT |
| Utvidet beskrivelse: | IGBT Module NPT Three Phase Inverter 600V 170A 515W Chassis Mount E3 |
| Beskrivelse: | TRANS 16BIY 3-PH 600V 115AMP |
| Gjeldende - Samler Cutoff (Maks): | 1.5mA |
| Nåværende - Samler (Ic) (Maks): | 170A |
| konfigurasjon: | Three Phase Inverter |
| Email: | [email protected] |
Beslektede deler til MWI150-06A8
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MWI150-12T8T | IXYS | MOD IGBT TRENCH SIXPACK E3 | Forespørsel |
|
MWI15-12A7 | IXYS | MOD IGBT SIXPACK RBSOA 1200V E2 | Forespørsel |
|
MWI25-12A7T | IXYS | MOD IGBT SIXPACK RBSOA 1200V E2 | Forespørsel |
|
MUBW10-06A6K | IXYS | MODULE IGBT CBI E1 | Forespørsel |
|
MWI15-12A6K | IXYS | MOD IGBT RBSOA SIXPACK E1 | Forespørsel |
 |
CM100DY-24A | Powerex Inc. | IGBT MOD DUAL 1200V 100A A SER | Forespørsel |
|
MWI150-06A8T | IXYS | IGBT SIXPACK 170A 600V E3PACK | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog