Kjøpe MWI60-06G6K med BYCHPS
Kjøp med garanti
MWI60-06G6K
- Delenummer:
- MWI60-06G6K
- Produsent:
- IXYS Corporation
- Beskrivelse:
- MOD IGBT SIX-PACK RBSOA E1
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19732 Pieces
- Dataark:
- MWI60-06G6K.pdf
Introduksjon
BYCHIPS er strømprodusenten for MWI60-06G6K, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for MWI60-06G6K via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.8V @ 15V, 30A |
| Leverandør Enhetspakke: | E1 |
| Serie: | - |
| Strøm - Maks: | 180W |
| Pakke / tilfelle: | E1 |
| Driftstemperatur: | -40°C ~ 125°C (TJ) |
| NTC-termistor: | Yes |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | MWI60-06G6K |
| Input Kapasitans (Cies) @ Vce: | 2.5nF @ 25V |
| Input: | Standard |
| IGBT Type: | - |
| Utvidet beskrivelse: | IGBT Module Three Phase Inverter 600V 60A 180W Chassis Mount E1 |
| Beskrivelse: | MOD IGBT SIX-PACK RBSOA E1 |
| Gjeldende - Samler Cutoff (Maks): | 200µA |
| Nåværende - Samler (Ic) (Maks): | 60A |
| konfigurasjon: | Three Phase Inverter |
| Email: | [email protected] |
Beslektede deler til MWI60-06G6K
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
CM400HA-34H | Powerex Inc. | IGBT MOD SGL 1700V 400A H SER | Forespørsel |
 |
APTGT100H170G | Microsemi Corporation | IGBT MOD TRENCH FULL BRIDGE SP6 | Forespørsel |
 |
MWI60-12T6K | IXYS | MOD IGBT SIXPACK RBSOA 1200V E1 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog