Kjøpe NCT7717U TR med BYCHPS
Kjøp med garanti
NCT7717U TR
- Delenummer:
- NCT7717U TR
- Produsent:
- Nuvoton Technology Corporation America
- Beskrivelse:
- IC SMBUS TEMP SENSOR 8MSOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13979 Pieces
- Dataark:
- NCT7717U TR.pdf
Introduksjon
BYCHIPS er strømprodusenten for NCT7717U TR, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for NCT7717U TR via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3.3V |
|---|---|
| topologi: | ADC, Comparator, Register Bank |
| Leverandør Enhetspakke: | SOT-23-5 |
| Serie: | - |
| Sensortype: | Internal |
| Sensing Temperatur: | -40°C ~ 125°C |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | SC-74A, SOT-753 |
| Utgangstype: | I²C/SMBus |
| Utgangsvifte: | No |
| Output Alarm: | Yes |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | NCT7717U TR |
| Funksjon: | Temp Monitoring System (Sensor) |
| Utvidet beskrivelse: | Temp Monitoring System (Sensor) -40°C ~ 125°C Internal Sensor I²C/SMBus Output SOT-23-5 |
| Beskrivelse: | IC SMBUS TEMP SENSOR 8MSOP |
| nøyaktighet: | ±3°C(Max) |
| Email: | [email protected] |
Beslektede deler til NCT7717U TR
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
NE1619DS,118 | NXP USA Inc. | IC TEMP MONITOR 16SSOP | Forespørsel |
 |
ADM1021ARQZ-R7 | ON Semiconductor | IC TEMP SENSOR DUAL3/5.5V 16QSOP | Forespørsel |
 |
W83783G T&R | Nuvoton Technology Corporation of America | IC MONITOR H/W 24-SOIC | Forespørsel |
|
NCT7718W TR | Nuvoton Technology Corporation of America | IC SMBUS TEMP SENSOR 8MSOP | Forespørsel |
|
ADM1023ARQZ-R7 | ON Semiconductor | IC TEMP SENSOR DUAL PREC 16QSOP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers