Kjøpe NSVJ2394SA3T1G med BYCHPS
Kjøp med garanti
NSVJ2394SA3T1G
- Delenummer:
- NSVJ2394SA3T1G
- Produsent:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- IC JFET N-CH LNA SC59-3
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12031 Pieces
- Dataark:
- NSVJ2394SA3T1G.pdf
Introduksjon
BYCHIPS er strømprodusenten for NSVJ2394SA3T1G, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for NSVJ2394SA3T1G via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Cutoff (VGS av) @ Id: | 700mV @ 100µA |
|---|---|
| Spenning - sammenbrudd (V (BR) GSS): | 15V |
| Leverandør Enhetspakke: | SC-59-3/CP3 |
| Serie: | Automotive, AEC-Q101 |
| Motstand - RDS (På): | - |
| Strøm - Maks: | 200mW |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-236-3, SC-59, SOT-23-3 |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 4 Weeks |
| Produsentens varenummer: | NSVJ2394SA3T1G |
| Inputkapasitans (Ciss) (Maks) @ Vds: | 10pF @ 5V |
| FET Type: | N-Channel |
| Utvidet beskrivelse: | JFET N-Channel 32mA @ 5V 200mW Surface Mount SC-59-3/CP3 |
| Drain til Source Voltage (VDSS): | 15V |
| Beskrivelse: | IC JFET N-CH LNA SC59-3 |
| Nåværende avløp (Id) - Maks: | 50mA |
| Nåværende - Drain (Idss) @ Vds (Vgs = 0): | 32mA @ 5V |
| Email: | [email protected] |
Beslektede deler til NSVJ2394SA3T1G
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
BFR31,235 | NXP USA Inc. | JFET N-CH 10MA 250MW SOT23 | Forespørsel |
 |
2N4416A | Central Semiconductor Corp | JFET N-CH 35V 0.3W TO-72 | Forespørsel |
 |
MPF4392G | ON Semiconductor | JFET N-CH 30V 0.35W TO92 | Forespørsel |
 |
2N5460_D74Z | Fairchild/ON Semiconductor | JFET P-CH 40V 0.35W TO92 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers