Kjøpe NTPAD160LD6A0 med BYCHPS
Kjøp med garanti
NTPAD160LD6A0
- Delenummer:
- NTPAD160LD6A0
- Produsent:
- Murata Electronics
- Beskrivelse:
- ICL 16 OHM 15% 2A 13MM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15634 Pieces
- Dataark:
- NTPAD160LD6A0.pdf
Introduksjon
BYCHIPS er strømprodusenten for NTPAD160LD6A0, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for NTPAD160LD6A0 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | ±15% |
|---|---|
| Serie: | NTPAD |
| R @ Current: | - |
| R 25 ° C: | 16 Ohm |
| emballasje: | Tape & Box (TB) |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | NTPAD160LD6A0 |
| Lead Spacing: | 0.295" (7.50mm) |
| Utvidet beskrivelse: | Inrush Current Limiter 16 Ohm Ohm ±15% 0.51" (13mm) |
| Diameter: | 0.51" (13mm) |
| Beskrivelse: | ICL 16 OHM 15% 2A 13MM |
| Strøm - Stabil tilstand Maks: | 2A |
| godkjenninger: | - |
| Email: | [email protected] |
Beslektede deler til NTPAD160LD6A0
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
NTPAD160LDNB0 | Murata Electronics North America | ICL 16 OHM 15% 2A 13MM | Forespørsel |
|
NTPAD8R0LD6A0 | Murata Electronics North America | ICL 8 OHM 15% 2.7A 13MM | Forespørsel |
 |
SL22 10008-B | Ametherm | ICL 10 OHM 20% 8A 22MM | Forespørsel |
 |
MF72-030D13 | Cantherm | ICL 30 OHM 20% 2.5A 15.5MM | Forespørsel |
 |
MF72-005D5 | Cantherm | ICL 5 OHM 20% 1A 7MM | Forespørsel |
|
SL22 20007-A | Ametherm | ICL 20 OHM 25% 7A 22MM | Forespørsel |
|
NTPAD5R1LD6A0 | Murata Electronics North America | ICL 5.1 OHM 15% 3A 13MM | Forespørsel |
|
NTPAD8R0LDNB0 | Murata Electronics North America | ICL 8 OHM 15% 2.7A 13MM | Forespørsel |
|
NTPAD5R1LDNB0 | Murata Electronics North America | ICL 5.1 OHM 15% 3A 13MM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers