Kjøpe NTPAJ8R0LDKB0 med BYCHPS
Kjøp med garanti
NTPAJ8R0LDKB0
- Delenummer:
- NTPAJ8R0LDKB0
- Produsent:
- Murata Electronics
- Beskrivelse:
- ICL 8 OHM 15% 3A 18MM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 20064 Pieces
- Dataark:
- NTPAJ8R0LDKB0.pdf
Introduksjon
BYCHIPS er strømprodusenten for NTPAJ8R0LDKB0, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for NTPAJ8R0LDKB0 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | ±15% |
|---|---|
| Serie: | NTPAJ |
| R @ Current: | - |
| R 25 ° C: | 8 Ohm |
| emballasje: | Bulk |
| Andre navn: | 490-3947 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 15 Weeks |
| Produsentens varenummer: | NTPAJ8R0LDKB0 |
| Lead Spacing: | 0.394" (10.00mm) |
| Utvidet beskrivelse: | Inrush Current Limiter 8 Ohm Ohm ±15% 0.709" (18mm) |
| Diameter: | 0.709" (18mm) |
| Beskrivelse: | ICL 8 OHM 15% 3A 18MM |
| Strøm - Stabil tilstand Maks: | 3A |
| godkjenninger: | - |
| Email: | [email protected] |
Beslektede deler til NTPAJ8R0LDKB0
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
NF20AA0409M-- | AVX Corporation | ICL 4 OHM 20% 6.4A 20MM | Forespørsel |
 |
MF72-002.5D11 | Cantherm | ICL 2.5 OHM 20% 5A 13MM | Forespørsel |
 |
SG308 | Ametherm | ICL 4 OHM 15% 8A | Forespørsel |
 |
SL18 47003-B | Ametherm | ICL 47 OHM 20% 3A 19MM | Forespørsel |
 |
NTPAJ4R0LDKB0 | Murata Electronics North America | ICL 4 OHM 15% 4A 18MM | Forespørsel |
|
NTPAJ100LDKB0 | Murata Electronics North America | ICL 10 OHM 15% 2.6A 18MM | Forespørsel |
|
NTPAJ6R0LDKB0 | Murata Electronics North America | ICL 6 OHM 15% 3.4A 18MM | Forespørsel |
 |
B57237S600M51 | EPCOS (TDK) | ICL 60 OHM 20% 2A 15MM | Forespørsel |
 |
SL32 0R540-B | Ametherm | ICL 0.5 OHM 20% 40A 30MM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers