Kjøpe OMI-SS-124L,300 med BYCHPS
Kjøp med garanti
OMI-SS-124L,300
- Delenummer:
- OMI-SS-124L,300
- Beskrivelse:
- RELAY GEN PURPOSE SPDT 10A 24V
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS-kompatibel
- Tilgjengelig mengde:
- 15717 Pieces
- Dataark:
- OMI-SS-124L,300.pdf
Introduksjon
BYCHIPS er strømprodusenten for OMI-SS-124L,300, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for OMI-SS-124L,300 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Slå på spenning (maks): | 18 VDC |
|---|---|
| Slå av spenning (Min): | 1.2 VDC |
| Oppsigelsesstil: | PC Pin |
| Bryter spenning: | 250VAC, 30VDC - Max |
| Serie: | OMI, OEG |
| Frigjør tid: | 8ms |
| Relé Type: | General Purpose |
| emballasje: | Bulk |
| Andre navn: | 6-1440000-0 6-1440000-0-ND 614400000 OMI-SS-124L,300-ND PB1669 |
| Driftstemperatur: | -30°C ~ 70°C |
| Bruk tid: | 20ms |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 23 Weeks |
| Produsentens varenummer: | OMI-SS-124L,300 |
| Egenskaper: | Sealed - Flux Protection |
| Utvidet beskrivelse: | General Purpose Relay SPDT (1 Form C) 24VDC Coil Through Hole |
| Beskrivelse: | RELAY GEN PURPOSE SPDT 10A 24V |
| Kontakt Rating (Nåværende): | 10A |
| Kontaktmateriale: | Silver Tin Oxide (AgSnO) |
| Kontakt skjema: | SPDT (1 Form C) |
| Spolespenning: | 24VDC |
| Spole type: | Non Latching |
| Coil Resistance: | 1.1 kOhms |
| Coil Power: | 540 mW |
| Coil Current: | 22.5mA |
| Email: | [email protected] |
Beslektede deler til OMI-SS-124L,300
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers