Kjøpe OR3T556BA256-DB med BYCHPS
Kjøp med garanti
OR3T556BA256-DB
- Delenummer:
- OR3T556BA256-DB
- Produsent:
- Lattice Semiconductor
- Beskrivelse:
- IC FPGA 223 I/O 256BGA
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 14028 Pieces
- Dataark:
- OR3T556BA256-DB.pdf
Introduksjon
BYCHIPS er strømprodusenten for OR3T556BA256-DB, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for OR3T556BA256-DB via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 3 V ~ 3.6 V |
|---|---|
| Totalt RAM-bit: | 43008 |
| Leverandør Enhetspakke: | 256-BGA (17x17) |
| Serie: | ORCA® 3 |
| Pakke / tilfelle: | 256-BGA |
| Driftstemperatur: | 0°C ~ 70°C (TA) |
| Antall logiske elementer / celler: | 2592 |
| Antall I / O: | 223 |
| Antall porte: | 80000 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | OR3T556BA256-DB |
| Beskrivelse: | IC FPGA 223 I/O 256BGA |
| Email: | [email protected] |
Beslektede deler til OR3T556BA256-DB
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
OR3T556S208-DB | Lattice Semiconductor Corporation | IC FPGA 171 I/O 208QFP | Forespørsel |
|
OR3T556BA256I-DB | Lattice Semiconductor Corporation | IC FPGA 223 I/O 256BGA | Forespørsel |
 |
LFE3-70E-7FN672C | Lattice Semiconductor Corporation | IC FPGA 380 I/O 672FBGA | Forespørsel |
|
OR3T557BA256-DB | Lattice Semiconductor Corporation | IC FPGA 223 I/O 256BGA | Forespørsel |
|
OR3T557S208-DB | Lattice Semiconductor Corporation | IC FPGA 171 I/O 208QFP | Forespørsel |
 |
AGLP060V2-CS289 | Microsemi Corporation | IC FPGA 157 I/O 289CSP | Forespørsel |
 |
M2GL150TS-FCSG536 | Microsemi Corporation | IC FPGA 293 I/O 536FCBGA | Forespørsel |
|
OR3T556S208I-DB | Lattice Semiconductor Corporation | IC FPGA 171 I/O 208QFP | Forespørsel |
 |
AT40K10LV-3BQI | Microchip Technology | IC FPGA 3.3V 576 CELL 144-LQFP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog