Kjøpe OTBH105KNPIR-F med BYCHPS
Kjøp med garanti
OTBH105KNPIR-F
- Delenummer:
- OTBH105KNPIR-F
- Produsent:
- Cornell Dubilier Electronics
- Beskrivelse:
- CAP FILM 1UF 10% 1.5KVDC QC TERM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12896 Pieces
- Dataark:
- OTBH105KNPIR-F.pdf
Introduksjon
BYCHIPS er strømprodusenten for OTBH105KNPIR-F, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for OTBH105KNPIR-F via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsverdier - DC: | 1500V (1.5kV) |
|---|---|
| Spenningsverdier - AC: | 660V |
| Toleranse: | ±10% |
| Avslutning: | Quick Connect, Disconnect |
| Størrelse / Dimensjon: | 2.160" L x 1.310" W (54.86mm x 33.27mm), Lip |
| Serie: | OTB |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | 338-4143 OTBH105KNPIR-F-ND |
| Driftstemperatur: | -55°C ~ 85°C |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | OTBH105KNPIR-F |
| Lead Spacing: | 0.810" (20.57mm) |
| Høyde - sittende (maks): | 2.250" (57.15mm) |
| Egenskaper: | - |
| Utvidet beskrivelse: | 1µF ±10% Film Capacitor 660V 1500V (1.5kV) Paper, Metallized Radial, Can |
| ESR (ekvivalent serieresistens): | - |
| Dielektrisk materiale: | Paper, Metallized |
| Beskrivelse: | CAP FILM 1UF 10% 1.5KVDC QC TERM |
| kapasitans: | 1µF |
| applikasjoner: | DC Link, DC Filtering; Motor Run |
| Email: | [email protected] |
Beslektede deler til OTBH105KNPIR-F
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers