Kjøpe PAC300001507FAC000 med BYCHPS
Kjøp med garanti
PAC300001507FAC000
- Delenummer:
- PAC300001507FAC000
- Produsent:
- Angstrohm / Vishay
- Beskrivelse:
- RES 0.15 OHM 3W 1% AXIAL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16640 Pieces
- Dataark:
- PAC300001507FAC000.pdf
Introduksjon
BYCHIPS er strømprodusenten for PAC300001507FAC000, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for PAC300001507FAC000 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | ±1% |
|---|---|
| Temperaturkoeffisient: | ±100ppm/°C |
| Leverandør Enhetspakke: | Axial |
| Størrelse / Dimensjon: | 0.217" Dia x 0.650" L (5.50mm x 16.50mm) |
| Serie: | PAC |
| Motstand (ohm): | 0.15 |
| Strøm (Watts): | 3W |
| emballasje: | Tape & Box (TB) |
| Pakke / tilfelle: | Axial |
| Andre navn: | 2306 327 11507 2306 327 11507BC 230632711507 230632711507BC PAC03D0R150F PAC3D.15TB PAC3D.15TB-ND PPC3D.15TB |
| Driftstemperatur: | -55°C ~ 275°C |
| Antall oppsigelser: | 2 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 13 Weeks |
| Produsentens varenummer: | PAC300001507FAC000 |
| Høyde - sittende (maks): | - |
| Egenskaper: | Flame Retardant Coating, Pulse Withstanding, Safety |
| Strykprosent: | - |
| Utvidet beskrivelse: | 0.15 Ohm ±1% 3W Through Hole Resistor Axial Flame Retardant Coating, Pulse Withstanding, Safety Wirewound |
| Beskrivelse: | RES 0.15 OHM 3W 1% AXIAL |
| sammensetning: | Wirewound |
| Email: | [email protected] |
Beslektede deler til PAC300001507FAC000
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers