Kjøpe PAS0815LR2R3105 med BYCHPS
Kjøp med garanti
PAS0815LR2R3105
- Delenummer:
- PAS0815LR2R3105
- Produsent:
- Taiyo Yuden
- Beskrivelse:
- CAP 1F 20% 2.3V THROUGH HOLE
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 17005 Pieces
Introduksjon
BYCHIPS er strømprodusenten for PAS0815LR2R3105, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for PAS0815LR2R3105 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.3V |
|---|---|
| Toleranse: | ±20% |
| Avslutning: | Through Hole |
| Størrelse / Dimensjon: | 0.315" Dia (8.00mm) |
| Serie: | LR |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can |
| Andre navn: | 587-2015 |
| Driftstemperatur: | -25°C ~ 60°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | PAS0815LR2R3105 |
| Levetid @ Temp.: | - |
| Lead Spacing: | 0.138" (3.50mm) |
| Høyde - sittende (maks): | 0.669" (17.00mm) |
| Utvidet beskrivelse: | 1F ±20%(EDLC) Supercapacitor 2.3V Radial, Can 70 mOhm |
| ESR (ekvivalent serieresistens): | 70 mOhm |
| Beskrivelse: | CAP 1F 20% 2.3V THROUGH HOLE |
| kapasitans: | 1F |
| Email: | [email protected] |
Beslektede deler til PAS0815LR2R3105
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
JJD0E238MSEF | Nichicon | CAP 2300F 20% 2.5V CHASSIS MOUNT | Forespørsel |
 |
PAS0815LN2R7205 | Taiyo Yuden | CAP 2F 20% 2.7V THROUGH HOLE | Forespørsel |
 |
EDLNF224A5R5C | Cornell Dubilier Electronics (CDE) | CAP 220MF 5.5V THROUGH HOLE | Forespørsel |
 |
PAS0815LA2R3185 | Taiyo Yuden | CAP 1.8F 20% 2.3V THROUGH HOLE | Forespørsel |
 |
PAS0815LS2R5105 | Taiyo Yuden | CAP 1F 20% 2.5V THROUGH HOLE | Forespørsel |
 |
BZ125A105ZLB | AVX Corporation | CAP 1F -20% +80% 5.5V SMD | Forespørsel |
 |
PC10-270 | Maxwell Technologies Inc. | CAP 10F 2.5V THROUGH HOLE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog