Kjøpe PBSS4260QAZ med BYCHPS
Kjøp med garanti
PBSS4260QAZ
- Delenummer:
- PBSS4260QAZ
- Produsent:
- Nexperia
- Beskrivelse:
- TRANS NPN 60V 2A DFN1010D-3
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19188 Pieces
- Dataark:
- PBSS4260QAZ.pdf
Introduksjon
BYCHIPS er strømprodusenten for PBSS4260QAZ, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for PBSS4260QAZ via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 60V |
|---|---|
| Vce Metning (Maks) @ Ib, Ic: | 190mV @ 50mA, 1A |
| Transistor Type: | NPN |
| Leverandør Enhetspakke: | DFN1010D-3 |
| Serie: | - |
| Strøm - Maks: | 325mW |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 3-XDFN Exposed Pad |
| Andre navn: | 1727-1464-2 1727-1464-2-ND 1727-2381-2 568-10935-2 568-10935-2-ND 568-12680-2 568-12680-2-ND 934067162147 PBSS4260QA PBSS4260QA,147 PBSS4260QAZ-ND |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | PBSS4260QAZ |
| Frekvens - Overgang: | 180MHz |
| Utvidet beskrivelse: | Bipolar (BJT) Transistor NPN 60V 2A 180MHz 325mW Surface Mount DFN1010D-3 |
| Beskrivelse: | TRANS NPN 60V 2A DFN1010D-3 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 40 @ 2A, 2V |
| Gjeldende - Samler Cutoff (Maks): | 100nA (ICBO) |
| Nåværende - Samler (Ic) (Maks): | 2A |
| Email: | [email protected] |
Beslektede deler til PBSS4260QAZ
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers