Kjøpe PM1008S-3R9M-RC med BYCHPS
Kjøp med garanti
PM1008S-3R9M-RC
- Delenummer:
- PM1008S-3R9M-RC
- Produsent:
- Bourns, Inc.
- Beskrivelse:
- FIXED IND 3.9UH 1.2A 260 MOHM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19107 Pieces
- Dataark:
- PM1008S-3R9M-RC.pdf
Introduksjon
BYCHIPS er strømprodusenten for PM1008S-3R9M-RC, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for PM1008S-3R9M-RC via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Wirewound |
|---|---|
| Toleranse: | ±20% |
| Leverandør Enhetspakke: | 1008 (2520 Metric) |
| Størrelse / Dimensjon: | 0.150" L x 0.150" W (3.81mm x 3.81mm) |
| skjerming: | Shielded |
| Serie: | PM1008S |
| rangeringer: | - |
| Q @ Freq: | 38 @ 1MHz |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | Nonstandard |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Materiale - Kjerne: | Ferrite |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | PM1008S-3R9M-RC |
| induktans: | 3.9µH |
| Høyde - sittende (maks): | 0.108" (2.74mm) |
| Frekvens - Test: | 100kHz |
| Frekvens - Selvresonans: | 175MHz |
| Utvidet beskrivelse: | 3.9µH Shielded Wirewound Inductor 1.2A 260 mOhm Max Nonstandard |
| Beskrivelse: | FIXED IND 3.9UH 1.2A 260 MOHM |
| DC-motstand (DCR): | 260 mOhm Max |
| Nåværende vurdering: | 1.2A |
| Nåværende - Metning: | - |
| Email: | [email protected] |
Beslektede deler til PM1008S-3R9M-RC
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers