Kjøpe PMC0603-151 med BYCHPS
Kjøp med garanti
PMC0603-151
- Delenummer:
- PMC0603-151
- Produsent:
- Bourns, Inc.
- Beskrivelse:
- FERRITE BEAD 150 OHM 0603 1LN
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 17060 Pieces
- Dataark:
- PMC0603-151.pdf
Introduksjon
BYCHIPS er strømprodusenten for PMC0603-151, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for PMC0603-151 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Størrelse / Dimensjon: | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
|---|---|
| Serie: | PMC |
| rangeringer: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 0603 (1608 Metric) |
| Andre navn: | PMC0603151 |
| Driftstemperatur: | -55°C ~ 125°C |
| Antall linjer: | 1 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | PMC0603-151 |
| Impedans @ Frekvens: | 150 Ohm @ 100MHz |
| Høyde (maks): | 0.031" (0.80mm) |
| Filter Type: | - |
| Beskrivelse: | FERRITE BEAD 150 OHM 0603 1LN |
| DC-motstand (DCR) (maks): | 400 mOhm |
| Nåværende vurdering (Maks): | 100mA |
| Email: | [email protected] |
Beslektede deler til PMC0603-151
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
PMC0603-601 | Bourns Inc. | FERRITE BEAD 600 OHM 0603 1LN | Forespørsel |
|
PMC0603-102 | Bourns Inc. | FERRITE BEAD 1 KOHM 0603 1LN | Forespørsel |
|
PMC0603-202 | Bourns Inc. | FERRITE BEAD 2 KOHM 0603 1LN | Forespørsel |
|
PMC0603-152 | Bourns Inc. | FERRITE BEAD 1.5 KOHM 0603 1LN | Forespørsel |
|
PMC0603-300 | Bourns Inc. | FERRITE BEAD 30 OHM 0603 1LN | Forespørsel |
|
PMC0603-600 | Bourns Inc. | FERRITE BEAD 60 OHM 0603 1LN | Forespørsel |
|
PMC0603-301 | Bourns Inc. | FERRITE BEAD 300 OHM 0603 1LN | Forespørsel |
|
PMC0603-101 | Bourns Inc. | FERRITE BEAD 100 OHM 0603 1LN | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers