Kjøpe PP200B060 med BYCHPS
Kjøp med garanti
PP200B060
- Delenummer:
- PP200B060
- Produsent:
- Powerex, Inc.
- Beskrivelse:
- IGBT ASSEMBLY HBRIDGE 600V 200A
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 13664 Pieces
- Dataark:
- PP200B060.pdf
Introduksjon
BYCHIPS er strømprodusenten for PP200B060, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for PP200B060 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Isolasjon: | 2500VDC |
|---|---|
| Spenning: | 600V |
| Type: | IGBT |
| Serie: | - |
| Pakke / tilfelle: | Power Module |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | PP200B060 |
| Utvidet beskrivelse: | Power Driver Module IGBT H-Bridge Inverter 600V 200A Power Module |
| Beskrivelse: | IGBT ASSEMBLY HBRIDGE 600V 200A |
| Nåværende: | 200A |
| konfigurasjon: | H-Bridge Inverter |
| Email: | [email protected] |
Beslektede deler til PP200B060
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
PS11012 | Powerex Inc. | MOD IPM 3PHASE IGBT 600V 4A | Forespørsel |
|
PP200T120 | Powerex Inc. | IGBT ASSY 3-PHASE 1200V 200A | Forespørsel |
 |
FSBB30CH60D | Fairchild/ON Semiconductor | MODULE SPM 600V 30A SPMPA | Forespørsel |
|
MIG200Q2CSB1X | Powerex Inc. | IPM MOD CMPCT DUAL 1200V 200A | Forespørsel |
 |
FSBS3CH60 | Fairchild/ON Semiconductor | MODULE SPM 600V 3A SPMBA | Forespørsel |
|
PP200B120 | Powerex Inc. | IGBT ASSY H-BRIDGE 1200V 200A | Forespørsel |
|
PP200T060 | Powerex Inc. | IGBT ASSEMBLY 3-PHASE 600V 200A | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers