Kjøpe PVDZ172NS-T med BYCHPS
Kjøp med garanti
PVDZ172NS-T
- Delenummer:
- PVDZ172NS-T
- Beskrivelse:
- IC RELAY PHOTOV 60V 1.5A 8SMD
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 19802 Pieces
- Dataark:
- PVDZ172NS-T.pdf
Introduksjon
BYCHIPS er strømprodusenten for PVDZ172NS-T, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for PVDZ172NS-T via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Last: | 0 ~ 60 V |
|---|---|
| Spenning - Inngang: | 1.2VDC |
| Oppsigelsesstil: | Gull Wing |
| Leverandør Enhetspakke: | 8-SMT Modified |
| Serie: | PVD, HEXFET® |
| Relé Type: | Relay |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 8-SMD (0.300", 7.62mm) 4 Leads |
| Utgangstype: | DC |
| Andre navn: | PVDZ172NST |
| On-State Resistance (Max): | 250 mOhm |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 4 (72 Hours) |
| Produsentens varenummer: | PVDZ172NS-T |
| Last Current: | 1.5A |
| Utvidet beskrivelse: | Solid State Relay SPST-NO (1 Form A) 8-SMD (0.300", 7.62mm) 4 Leads |
| Beskrivelse: | IC RELAY PHOTOV 60V 1.5A 8SMD |
| Krets: | SPST-NO (1 Form A) |
| Email: | [email protected] |
Beslektede deler til PVDZ172NS-T
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
PVDZ172NS | Infineon Technologies | IC RELAY PHOTOVO 60V 1.5A 8-SMD | Forespørsel |
 |
PVDZ172NPBF | Infineon Technologies | IC RELAY PHOTOVO 60V 1.5A 8-DIP | Forespørsel |
|
PVDZ172NSPBF | Infineon Technologies | IC RELAY PHOTOVO 60V 1.5A 8-SMD | Forespørsel |
|
PVDZ172NS-TPBF | Infineon Technologies | IC RELAY PHOTOVO 60V 1.5A 8-SMD | Forespørsel |
 |
CMRA4835 | Crydom Co. | RELAY SSR SCR 35A 530V PNL MNT | Forespørsel |
 |
E-1048-8C5-C3A4V0-4U3-2A | E-T-A | CIR BRKR THRM 2A | Forespørsel |
 |
PVDZ172N | Infineon Technologies | IC RELAY PHOTOVO 60V 1.5A 8-DIP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog