Kjøpe PXAC241702FCV1XWSA1 med BYCHPS
Kjøp med garanti
PXAC241702FCV1XWSA1
- Delenummer:
- PXAC241702FCV1XWSA1
- Beskrivelse:
- IC AMP RF LDMOS
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15176 Pieces
- Dataark:
- PXAC241702FCV1XWSA1.pdf
Introduksjon
BYCHIPS er strømprodusenten for PXAC241702FCV1XWSA1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for PXAC241702FCV1XWSA1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Test: | 28V |
|---|---|
| Spenningsvurdering: | 65V |
| Transistor Type: | LDMOS |
| Leverandør Enhetspakke: | H-37248-4 |
| Serie: | - |
| Power - Output: | 28W |
| emballasje: | Tray |
| Pakke / tilfelle: | H-37248-4 |
| Andre navn: | SP001274012 |
| Støy Figur: | - |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens varenummer: | PXAC241702FCV1XWSA1 |
| Gevinst: | 16.5dB |
| Frekvens: | 2.4GHz |
| Utvidet beskrivelse: | RF Mosfet LDMOS 28V 360mA 2.4GHz 16.5dB 28W H-37248-4 |
| Beskrivelse: | IC AMP RF LDMOS |
| Nåværende vurdering: | - |
| Nåværende - Test: | 360mA |
| Email: | [email protected] |
Beslektede deler til PXAC241702FCV1XWSA1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
PXAC261202FCV1R250XTMA1 | Infineon Technologies | FET RF 2CH 65V 2.61GHZ | Forespørsel |
|
PXAC243502FVV1R250XTMA1 | Infineon Technologies | IC AMP RF LDMOS | Forespørsel |
|
PXAC243502FVV1R0XTMA1 | Infineon Technologies | IC AMP RF LDMOS H-37275-4 | Forespørsel |
|
PXAC243502FVV1XWSA1 | Infineon Technologies | IC AMP RF LDMOS | Forespørsel |
|
PXAC241702FCV1R0XTMA1 | Infineon Technologies | IC AMP RF LDMOS H-37248-4 | Forespørsel |
|
PXAC241702FCV1R250XTMA1 | Infineon Technologies | IC AMP RF LDMOS | Forespørsel |
|
PXAC201202FCV2R250XTMA1 | Infineon Technologies | IC AMP RF LDMOS | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers