Kjøpe QIS4506002 med BYCHPS
Kjøp med garanti
QIS4506002
- Delenummer:
- QIS4506002
- Produsent:
- Powerex, Inc.
- Beskrivelse:
- IGBT MOD SINGLE 4500V 60A
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 16050 Pieces
- Dataark:
- QIS4506002.pdf
Introduksjon
BYCHIPS er strømprodusenten for QIS4506002, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for QIS4506002 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 4500V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 3.9V @ 15V, 67A |
| Leverandør Enhetspakke: | Module |
| Serie: | - |
| Strøm - Maks: | - |
| Pakke / tilfelle: | Module |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| NTC-termistor: | No |
| Monteringstype: | Chassis Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | QIS4506002 |
| Input Kapasitans (Cies) @ Vce: | 9nF @ 10V |
| Input: | Standard |
| IGBT Type: | - |
| Utvidet beskrivelse: | IGBT Module Single 4500V 60A Chassis Mount Module |
| Beskrivelse: | IGBT MOD SINGLE 4500V 60A |
| Gjeldende - Samler Cutoff (Maks): | 1mA |
| Nåværende - Samler (Ic) (Maks): | 60A |
| konfigurasjon: | Single |
| Email: | [email protected] |
Beslektede deler til QIS4506002
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
QIS4506001 | Powerex Inc. | IGBT MOD SINGLE 4500V 60A | Forespørsel |
 |
VS-GB100TH120N | Vishay Semiconductor Diodes Division | IGBT 1200V 200A 833W INT-A-PAK | Forespørsel |
 |
APTGF30H60T1G | Microsemi Corporation | IGBT MODULE NPT FULL BRIDGE SP1 | Forespørsel |
 |
APTGLQ600A65T6G | Microsemi Corporation | PWR MOD IGBT4 650V 1200A SP6 | Forespørsel |
|
VS-GT200TP065N | Vishay Semiconductor Diodes Division | IGBT | Forespørsel |
 |
FA300R12ME4BOSA1 | Infineon Technologies | MODULE IGBT ECONO DUAL 3 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers