Kjøpe R7S721020VCBG#AC1 med BYCHPS
Kjøp med garanti
R7S721020VCBG#AC1
- Delenummer:
- R7S721020VCBG#AC1
- Produsent:
- Renesas Electronics America
- Beskrivelse:
- IC MCU 32BIT ROMLESS 176LFBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16594 Pieces
- Dataark:
- R7S721020VCBG#AC1.pdf
Introduksjon
BYCHIPS er strømprodusenten for R7S721020VCBG#AC1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for R7S721020VCBG#AC1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning (Vcc / Vdd): | 1.1 V ~ 3.6 V |
|---|---|
| Leverandør Enhetspakke: | 176-LFBGA (8x8) |
| Hastighet: | 400MHz |
| Serie: | RZ/A1L |
| RAM-størrelse: | 3M x 8 |
| Programminnetype: | ROMless |
| Programminnestørrelse: | - |
| periferi~~POS=TRUNC: | DMA, POR, PWM, WDT |
| emballasje: | Tray |
| Pakke / tilfelle: | 176-LFBGA |
| Oscillator type: | External |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antall I / O: | 78 |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | R7S721020VCBG#AC1 |
| Utvidet beskrivelse: | ARM® Cortex®-A9 RZ/A1L Microcontroller IC 32-Bit 400MHz ROMless 176-LFBGA (8x8) |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 32BIT ROMLESS 176LFBGA |
| Datakonvertere: | A/D 8x12b |
| Kjernestørrelse: | 32-Bit |
| Kjerneprosessor: | ARM® Cortex®-A9 |
| tilkobling: | CAN, EBI/EMI, Ethernet, I²C, LIN, SCI, SPI, SSI, UART/USART, USB |
| Email: | [email protected] |
Beslektede deler til R7S721020VCBG#AC1
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers