Kjøpe RAA230231GSB#HA0 med BYCHPS
Kjøp med garanti
RAA230231GSB#HA0
- Delenummer:
- RAA230231GSB#HA0
- Produsent:
- Renesas Electronics America
- Beskrivelse:
- IC REG BCK ADJ/3.3V 3A 20-HTSSOP
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13882 Pieces
- Dataark:
- RAA230231GSB#HA0.pdf
Introduksjon
BYCHIPS er strømprodusenten for RAA230231GSB#HA0, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for RAA230231GSB#HA0 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Utgang (Min / Fast): | 0.8V (3.3V) |
|---|---|
| Spenning - utgang (maks): | 6V |
| Spenning - Inngang (Min): | 4.5V |
| Spenning - Inngang (Maks): | 16V |
| topologi: | Buck |
| Synkron Likner: | Yes |
| Leverandør Enhetspakke: | 20-HTSSOP |
| Serie: | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
| Utgangstype: | Adjustable (Fixed) |
| Utgangskonfigurasjon: | Positive |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Antall utganger: | 2 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | RAA230231GSB#HA0 |
| Funksjon: | Step-Down |
| Frekvens - Bytte: | 1.1MHz |
| Utvidet beskrivelse: | Buck Switching Regulator IC Positive Adjustable (Fixed) 0.8V (3.3V) 2 Output 3A 20-TSSOP (0.173", 4.40mm Width) Exposed Pad |
| Beskrivelse: | IC REG BCK ADJ/3.3V 3A 20-HTSSOP |
| Strøm - Utgang: | 3A |
| Email: | [email protected] |
Beslektede deler til RAA230231GSB#HA0
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers