Kjøpe RACF648NJT3K30 med BYCHPS
Kjøp med garanti
RACF648NJT3K30
- Delenummer:
- RACF648NJT3K30
- Produsent:
- Stackpole Electronics, Inc.
- Beskrivelse:
- RES ARRAY 8 RES 3.3K OHM 2512
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 14056 Pieces
- Dataark:
- RACF648NJT3K30.pdf
Introduksjon
BYCHIPS er strømprodusenten for RACF648NJT3K30, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for RACF648NJT3K30 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | ±5% |
|---|---|
| Temperaturkoeffisient: | ±200ppm/°C |
| Leverandør Enhetspakke: | 2512 |
| Størrelse / Dimensjon: | 0.252" L x 0.122" W (6.40mm x 3.10mm) |
| Serie: | RACF |
| Motstand (ohm): | 3.3k |
| Kraft per element: | 62.5mW |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 2512 (6432 Metric), Concave, Long Side Terminals |
| Driftstemperatur: | -55°C ~ 125°C |
| Antall motstandere: | 8 |
| Antall pinner: | 10 |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 11 Weeks |
| Produsentens varenummer: | RACF648NJT3K30 |
| Høyde - sittende (maks): | 0.028" (0.70mm) |
| Utvidet beskrivelse: | 3.3k Ohm ±5% 62.5mW Power Per Element Bussed Resistor Network/Array ±200ppm/°C 2512 (6432 Metric), Concave, Long Side Terminals |
| Beskrivelse: | RES ARRAY 8 RES 3.3K OHM 2512 |
| Kretskort: | Bussed |
| applikasjoner: | - |
| Email: | [email protected] |
Beslektede deler til RACF648NJT3K30
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog