Kjøpe RF600D-SO8R6 med BYCHPS
Kjøp med garanti
RF600D-SO8R6
- Delenummer:
- RF600D-SO8R6
- Produsent:
- RF Solutions
- Beskrivelse:
- I/C DECODER
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12237 Pieces
- Dataark:
- RF600D-SO8R6.pdf
Introduksjon
BYCHIPS er strømprodusenten for RF600D-SO8R6, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for RF600D-SO8R6 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Decoder |
|---|---|
| Leverandør Enhetspakke: | 18-SOIC |
| Serie: | - |
| emballasje: | Bulk |
| Pakke / tilfelle: | 18-SOIC (0.295", 7.50mm Width) |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 5 Weeks |
| Produsentens varenummer: | RF600D-SO8R6 |
| Utvidet beskrivelse: | Decoder IC RF, IR 18-SOIC |
| Beskrivelse: | I/C DECODER |
| applikasjoner: | RF, IR |
| Email: | [email protected] |
Beslektede deler til RF600D-SO8R6
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
XCMECH-FF324 | Xilinx Inc. | FF324 MECH SAMPLE OPEN O/E | Forespørsel |
 |
RF600D | RF Solutions | IC DECODER RECEIVER RF 18DIP | Forespørsel |
|
RF600E | RF Solutions | IC ENCODER TRANSMITTER RF 8DIP | Forespørsel |
 |
PTN3460BS/F2,518 | NXP USA Inc. | IC SPECIALIZED | Forespørsel |
 |
80HVPS1616CBR | IDT, Integrated Device Technology Inc | IC RIO SWITCH GEN2 400FCBGA | Forespørsel |
|
RF600E-SO | RF Solutions | I/C ENCODER, MANCHESTER KEELOQ S | Forespørsel |
 |
DLP4500NIRFQE | Texas Instruments | IC WXGA DMD .45 80LCCC | Forespørsel |
 |
DS2476Q+U | Maxim Integrated | IC SECURE COPROCESSOR W/EEPROM | Forespørsel |
 |
RF600D-SO | RF Solutions | I/C DECODER, MANCHESTER KEELOQ S | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers