Kjøpe RJH60M2DPE-00#J3 med BYCHPS
Kjøp med garanti
RJH60M2DPE-00#J3
- Delenummer:
- RJH60M2DPE-00#J3
- Produsent:
- Renesas Electronics America
- Beskrivelse:
- IGBT 600V 25A 63W LDPAK
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15350 Pieces
- Dataark:
- RJH60M2DPE-00#J3.pdf
Introduksjon
BYCHIPS er strømprodusenten for RJH60M2DPE-00#J3, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for RJH60M2DPE-00#J3 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 600V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 2.5V @ 15V, 12A |
| Testtilstand: | 300V, 12A, 5 Ohm, 15V |
| Td (på / av) @ 25 ° C: | 32ns/70ns |
| Bytte energi: | 180µJ (on), 180µJ (off) |
| Leverandør Enhetspakke: | 4-LDPAK |
| Serie: | - |
| Omvendt gjenopprettingstid (trr): | 85ns |
| Strøm - Maks: | 63W |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | SC-83 |
| Andre navn: | RJH60M2DPE-00#J3TR RJH60M2DPE00J3 |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | RJH60M2DPE-00#J3 |
| Inngangstype: | Standard |
| IGBT Type: | Trench |
| Gate Charge: | 33nC |
| Utvidet beskrivelse: | IGBT Trench 600V 25A 63W Surface Mount 4-LDPAK |
| Beskrivelse: | IGBT 600V 25A 63W LDPAK |
| Nåværende - Samlerpulserte (Icm): | - |
| Nåværende - Samler (Ic) (Maks): | 25A |
| Email: | [email protected] |
Beslektede deler til RJH60M2DPE-00#J3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers