Kjøpe RJP4301APP-M0#T2 med BYCHPS
Kjøp med garanti
RJP4301APP-M0#T2
- Delenummer:
- RJP4301APP-M0#T2
- Produsent:
- Renesas Electronics America
- Beskrivelse:
- IGBT 430V TO200FL
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19851 Pieces
- Dataark:
- RJP4301APP-M0#T2.pdf
Introduksjon
BYCHIPS er strømprodusenten for RJP4301APP-M0#T2, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for RJP4301APP-M0#T2 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 430V |
|---|---|
| Vce (på) (Maks) @ Vge, Ic: | 10V @ 26V, 200A |
| Testtilstand: | 300V, 200A, 30 Ohm, 26V |
| Td (på / av) @ 25 ° C: | 50ns/100ns |
| Bytte energi: | - |
| Leverandør Enhetspakke: | TO-220FL |
| Serie: | - |
| Strøm - Maks: | 30W |
| emballasje: | Tube |
| Pakke / tilfelle: | TO-220-3 Full Pack |
| Driftstemperatur: | -40°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 16 Weeks |
| Produsentens varenummer: | RJP4301APP-M0#T2 |
| Inngangstype: | Standard |
| IGBT Type: | - |
| Utvidet beskrivelse: | IGBT 430V 30W Through Hole TO-220FL |
| Beskrivelse: | IGBT 430V TO200FL |
| Nåværende - Samlerpulserte (Icm): | 200A |
| Nåværende - Samler (Ic) (Maks): | - |
| Email: | [email protected] |
Beslektede deler til RJP4301APP-M0#T2
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SGP04N60XKSA1 | Infineon Technologies | IGBT 600V 9.4A 50W TO220-3 | Forespørsel |
 |
IXGH30N60C2D1 | IXYS | IGBT 600V 70A 190W TO247 | Forespørsel |
 |
IXGA7N60CD1 | IXYS | IGBT 600V 14A 75W TO263 | Forespørsel |
 |
STGB40H65FB | STMicroelectronics | TRENCH GATE FIELD-STOP IGBT, HB | Forespørsel |
 |
FGH60N60SMD_F085 | Fairchild/ON Semiconductor | IGBT 600V 120A 600W TO247 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog