Kjøpe RM78702 med BYCHPS
Kjøp med garanti
RM78702
- Delenummer:
- RM78702
- Beskrivelse:
- RELAY SOCKET PC RM SERIES
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15487 Pieces
- Dataark:
- RM78702.pdf
Introduksjon
BYCHIPS er strømprodusenten for RM78702, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for RM78702 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Type: | Socket |
|---|---|
| Oppsigelsesstil: | PC Pin |
| Serie: | RM, SCHRACK |
| Andre navn: | 2-1393844-3 2-1393844-3-ND 213938443 RM78702-ND |
| Antall posisjoner: | 11 |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | RM78702 |
| For bruk med / relaterte produkter: | RM, SCHRACK |
| Egenskaper: | - |
| Utvidet beskrivelse: | Relay Socket Through Hole |
| Beskrivelse: | RELAY SOCKET PC RM SERIES |
| Email: | [email protected] |
Beslektede deler til RM78702
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
RSE500505 | Amphenol PCD | SMITHS, WC, NO HW | Forespørsel |
 |
25622130 | Crouzet | CONTROL TIMER ACCESS SOCKET 8P | Forespørsel |
 |
RM78700 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY CHAS MT RM SERIES | Forespørsel |
 |
RM78705 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY SCREW RM SERIES | Forespørsel |
 |
RM78704 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET SCREW RM SERIES | Forespørsel |
 |
2950695 | Phoenix Contact | RELAY MODULE 4PDT | Forespørsel |
 |
RM78701 | TE Connectivity Potter & Brumfield Relays | SOCKET RELAY CHAS MT RM SERIES | Forespørsel |
 |
2980238 | Phoenix Contact | 6.2MM PLC BASIC TERM BLOCK 5V | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers