Kjøpe RN55D37R4FBSL med BYCHPS
Kjøp med garanti
RN55D37R4FBSL
- Delenummer:
- RN55D37R4FBSL
- Produsent:
- Dale / Vishay
- Beskrivelse:
- RES 37.4 OHM 1/8W 1% AXIAL
- Lead Free Status / RoHS Status:
- Inneholder bly / RoHS ikke-kompatibel
- Tilgjengelig mengde:
- 18737 Pieces
- Dataark:
- RN55D37R4FBSL.pdf
Introduksjon
BYCHIPS er strømprodusenten for RN55D37R4FBSL, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for RN55D37R4FBSL via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | ±1% |
|---|---|
| Temperaturkoeffisient: | ±100ppm/°C |
| Leverandør Enhetspakke: | Axial |
| Størrelse / Dimensjon: | 0.090" Dia x 0.240" L (2.29mm x 6.10mm) |
| Serie: | Military, MIL-R-10509/7, RN55 |
| Motstand (ohm): | 37.4 |
| Strøm (Watts): | 0.125W, 1/8W |
| emballasje: | Bulk |
| Pakke / tilfelle: | Axial |
| Andre navn: | RN55D37R4FBSL-MIL |
| Driftstemperatur: | -65°C ~ 175°C |
| Antall oppsigelser: | 2 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 9 Weeks |
| Produsentens varenummer: | RN55D37R4FBSL |
| Høyde - sittende (maks): | - |
| Egenskaper: | Flame Retardant Coating, Military, Moisture Resistant, Safety |
| Strykprosent: | - |
| Utvidet beskrivelse: | 37.4 Ohm ±1% 0.125W, 1/8W Through Hole Resistor Axial Flame Retardant Coating, Military, Moisture Resistant, Safety Metal Film |
| Beskrivelse: | RES 37.4 OHM 1/8W 1% AXIAL |
| sammensetning: | Metal Film |
| Email: | [email protected] |
Beslektede deler til RN55D37R4FBSL
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog