Kjøpe RN779DT146 med BYCHPS
Kjøp med garanti
RN779DT146
- Delenummer:
- RN779DT146
- Produsent:
- LAPIS Semiconductor
- Beskrivelse:
- DIODE PIN 50V 50MA SMD3
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15314 Pieces
- Dataark:
- RN779DT146.pdf
Introduksjon
BYCHIPS er strømprodusenten for RN779DT146, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for RN779DT146 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Peak Reverse (Max): | 50V |
|---|---|
| Leverandør Enhetspakke: | SMD3 |
| Serie: | - |
| Motstand @ Hvis, F: | 7 Ohm @ 10mA, 100MHz |
| Strømdissipasjon (maks): | - |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-236-3, SC-59, SOT-23-3 |
| Andre navn: | RN779DT146TR |
| Driftstemperatur: | 150°C (TJ) |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | RN779DT146 |
| Utvidet beskrivelse: | RF Diode PIN - 1 Pair Series Connection 50V 50mA SMD3 |
| Diodetype: | PIN - 1 Pair Series Connection |
| Beskrivelse: | DIODE PIN 50V 50MA SMD3 |
| Nåværende - Maks: | 50mA |
| Kapasitans @ Vr, F: | 0.9pF @ 35V, 1MHz |
| Email: | [email protected] |
Beslektede deler til RN779DT146
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
MMBD301LT3 | ON Semiconductor | DIODE SCHOTTKY 200MW 30V SOT-23 | Forespørsel |
 |
HSMS-282C-TR2G | Broadcom Limited | DIODE SCHOTTKY RF SER 15V SOT323 | Forespørsel |
 |
S392D-HG3-08 | Vishay Semiconductor Diodes Division | DIODE RF PIN SOT23-HG3 | Forespørsel |
 |
RN779FT106 | Rohm Semiconductor | DIODE PIN HF SW 50V 50MA UMD3 | Forespørsel |
 |
MADL-011012-001 | M/A-Com Technology Solutions | 360 W CW POWER LIMITER | Forespørsel |
 |
BAR 64-02V E6327 | Infineon Technologies | DIODE RF SGL 150V 100MA SC-79 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog