Kjøpe RNCS0402BTE75K0 med BYCHPS
Kjøp med garanti
RNCS0402BTE75K0
- Delenummer:
- RNCS0402BTE75K0
- Produsent:
- Stackpole Electronics, Inc.
- Beskrivelse:
- RES SMD 75K OHM 0.1% 1/16W 0402
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15776 Pieces
Introduksjon
BYCHIPS er strømprodusenten for RNCS0402BTE75K0, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for RNCS0402BTE75K0 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | ±0.1% |
|---|---|
| Temperaturkoeffisient: | ±25ppm/°C |
| Leverandør Enhetspakke: | 0402 |
| Størrelse / Dimensjon: | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
| Serie: | RNCS |
| Motstand (ohm): | 75k |
| Strøm (Watts): | 0.063W, 1/16W |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 0402 (1005 Metric) |
| Andre navn: | RNCS 10 T9 75K 0.1% R RNCS10T975K0.1%R RNCS10T975K0.1%R-ND RNCS10T975KBR RNCS10T975KBR-ND |
| Driftstemperatur: | -55°C ~ 155°C |
| Antall oppsigelser: | 2 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | RNCS0402BTE75K0 |
| Høyde - sittende (maks): | 0.014" (0.35mm) |
| Egenskaper: | Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant |
| Strykprosent: | - |
| Utvidet beskrivelse: | 75k Ohm ±0.1% 0.063W, 1/16W Chip Resistor 0402 (1005 Metric) Anti-Corrosive, Automotive AEC-Q200, Moisture Resistant Thin Film |
| Beskrivelse: | RES SMD 75K OHM 0.1% 1/16W 0402 |
| sammensetning: | Thin Film |
| Email: | [email protected] |
Beslektede deler til RNCS0402BTE75K0
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers