Kjøpe SAC57D54HCVMO med BYCHPS
Kjøp med garanti
SAC57D54HCVMO
- Delenummer:
- SAC57D54HCVMO
- Produsent:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC MCU 32BIT 4MB FLASH 516MAPBGA
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13219 Pieces
- Dataark:
- SAC57D54HCVMO.pdf
Introduksjon
BYCHIPS er strømprodusenten for SAC57D54HCVMO, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SAC57D54HCVMO via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning (Vcc / Vdd): | 3.15 V ~ 5.5 V |
|---|---|
| Leverandør Enhetspakke: | 516-MAPBGA (27x27) |
| Hastighet: | 80MHz, 160MHz, 320MHz |
| Serie: | MAC57Dxxx |
| RAM-størrelse: | 2.3M x 8 |
| Programminnetype: | FLASH |
| Programminnestørrelse: | 4MB (4M x 8) |
| periferi~~POS=TRUNC: | DMA, LCD, LVD/HVD, POR, PWM, WDT |
| emballasje: | Tray |
| Pakke / tilfelle: | 516-BGA |
| Andre navn: | 935313269557 |
| Oscillator type: | Internal |
| Driftstemperatur: | -40°C ~ 105°C (TA) |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 20 Weeks |
| Produsentens varenummer: | SAC57D54HCVMO |
| Utvidet beskrivelse: | ARM® Cortex®-A5, -M4, -M0+ MAC57Dxxx Microcontroller IC 32-Bit Tri-Core 80MHz, 160MHz, 320MHz 4MB (4M x 8) FLASH 516-MAPBGA (27x27) |
| EEPROM-størrelse: | - |
| Beskrivelse: | IC MCU 32BIT 4MB FLASH 516MAPBGA |
| Datakonvertere: | A/D 24x12b |
| Kjernestørrelse: | 32-Bit Tri-Core |
| Kjerneprosessor: | ARM® Cortex®-A5, -M4, -M0+ |
| tilkobling: | CAN, EBI/EMI, Ethernet, I²C, LIN, SPI |
| Email: | [email protected] |
Beslektede deler til SAC57D54HCVMO
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers