Kjøpe SAE800GXLLA1 med BYCHPS
Kjøp med garanti
SAE800GXLLA1
- Delenummer:
- SAE800GXLLA1
- Beskrivelse:
- IC PROGRAMMABLE TONE GONG 8DSO
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15375 Pieces
- Dataark:
- SAE800GXLLA1.pdf
Introduksjon
BYCHIPS er strømprodusenten for SAE800GXLLA1, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SAE800GXLLA1 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | 2.8 V ~ 18 V |
|---|---|
| Leverandør Enhetspakke: | PG-DSO-8-1 |
| spesifikasjoner: | 100kHz |
| Serie: | - |
| emballasje: | Tube |
| Pakke / tilfelle: | 8-SOIC (0.154", 3.90mm Width) |
| Andre navn: | SP000697948 |
| Driftstemperatur: | -25°C ~ 125°C (TJ) |
| Antall kanaler: | 1 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 12 Weeks |
| Produsentens varenummer: | SAE800GXLLA1 |
| Interface: | Logic |
| Funksjon: | Audio Tone Processor |
| Utvidet beskrivelse: | Audio Audio Tone Processor 1 Channel PG-DSO-8-1 |
| Beskrivelse: | IC PROGRAMMABLE TONE GONG 8DSO |
| applikasjoner: | Audio Systems |
| Email: | [email protected] |
Beslektede deler til SAE800GXLLA1
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SAE800G GEG | Infineon Technologies | IC TONE GONG SGL/DUAL/TRPL P8DSO | Forespørsel |
 |
SAE800FKLA1 | Infineon Technologies | IC PROGRAMMABLE TONE GONG 8-DIP | Forespørsel |
 |
SAE800GGEGXUMA1 | Infineon Technologies | AUDIO AMPLIFIERS INDUSTRIAL IC | Forespørsel |
|
SAE800 | Infineon Technologies | IC PROGRAMMABLE TONE GONG 8-DIP | Forespørsel |
 |
ADAU71067Z-CSRL | Analog Devices Inc. | IC AUDIO | Forespørsel |
|
TS3A227EYFFR | Texas Instruments | IC AUDIO SWITCH 2X SPDT 16VQFN | Forespørsel |
|
E-TDA7333013TR | STMicroelectronics | IC PROCESSOR RDS/RBDS 16-TSSOP | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers