Kjøpe SCCY68B407VSB med BYCHPS
Kjøp med garanti
SCCY68B407VSB
- Delenummer:
- SCCY68B407VSB
- Produsent:
- AVX Corporation
- Beskrivelse:
- CAPACITOR 400F 2.7V SOLDER LUG
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 19238 Pieces
- Dataark:
- SCCY68B407VSB.pdf
Introduksjon
BYCHIPS er strømprodusenten for SCCY68B407VSB, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SCCY68B407VSB via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenningsvurdering: | 2.7V |
|---|---|
| Toleranse: | -5%, +25% |
| Avslutning: | PC Pins |
| Størrelse / Dimensjon: | 1.378" Dia (35.00mm) |
| Serie: | SCC |
| emballasje: | Bulk |
| Pakke / tilfelle: | Radial, Can - Solder Lug |
| Andre navn: | 478-10027 |
| Driftstemperatur: | -40°C ~ 65°C |
| Monteringstype: | Through Hole |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 3 Weeks |
| Produsentens varenummer: | SCCY68B407VSB |
| Levetid @ Temp.: | 1000 Hrs @ 60°C |
| Lead Spacing: | 0.886" (22.50mm) |
| Høyde - sittende (maks): | 2.756" (70.00mm) |
| Utvidet beskrivelse: | 400F -5%, +25%(EDLC) Supercapacitor 2.7V Radial, Can - Solder Lug 4 mOhm @ 1MHz 1000 Hrs @ 60°C |
| ESR (ekvivalent serieresistens): | 4 mOhm @ 1MHz |
| Beskrivelse: | CAPACITOR 400F 2.7V SOLDER LUG |
| kapasitans: | 400F |
| Email: | [email protected] |
Beslektede deler til SCCY68B407VSB
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
JJD0E807MSECBN | Nichicon | CAP 800F 20% 2.5V CHASSIS MOUNT | Forespørsel |
 |
PHV-5R4V255-R | Eaton | CAP 2.5F -10% +30% 5.4V T/H | Forespørsel |
 |
XB3550-2R5307-R | Eaton | CAP 300F 10% 2.5V THROUGH HOLE | Forespørsel |
 |
SCCY62V307VSB | AVX Corporation | CAPACITOR 300F 2.7V SOLDER LUG | Forespørsel |
 |
JJC0E338MSEJBN | Nichicon | CAP 3300F 20% 2.5V CHASSIS MOUNT | Forespørsel |
 |
EEC-HL0E506 | Panasonic Electronic Components | CAPACITOR 50F - 2.7V THRU HOLE | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers