Kjøpe SD1274 med BYCHPS
Kjøp med garanti
SD1274
- Delenummer:
- SD1274
- Produsent:
- ST
- Beskrivelse:
- TRANS NPN RF MICROWAVE VHF M135
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15507 Pieces
- Dataark:
- SD1274.pdf
Introduksjon
BYCHIPS er strømprodusenten for SD1274, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SD1274 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Samler Emitter Breakdown (Max): | 16V |
|---|---|
| Transistor Type: | NPN |
| Leverandør Enhetspakke: | M135 |
| Serie: | - |
| Strøm - Maks: | 70W |
| emballasje: | Bulk |
| Pakke / tilfelle: | M135 |
| Andre navn: | 497-5453 SD1274-ND |
| Driftstemperatur: | 200°C (TJ) |
| Støy Figur (dB Typ @ f): | - |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens varenummer: | SD1274 |
| Gevinst: | 10dB |
| Frekvens - Overgang: | - |
| Utvidet beskrivelse: | RF Transistor NPN 16V 8A 70W Surface Mount M135 |
| Beskrivelse: | TRANS NPN RF MICROWAVE VHF M135 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 20 @ 250mA, 5V |
| Nåværende - Samler (Ic) (Maks): | 8A |
| Email: | [email protected] |
Beslektede deler til SD1274
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SD1275-01 | STMicroelectronics | TRANS NPN RF MICROWAVE VHF M113 | Forespørsel |
 |
SD1275 | STMicroelectronics | TRANS NPN RF MICROWAVE VHF M135 | Forespørsel |
 |
10502 | Microsemi Corporation | TRANS BIPO 50V 500W 55SM | Forespørsel |
 |
BFU725F,115 | NXP USA Inc. | TRANS NPN 20GHZ SOT343F | Forespørsel |
|
SD1274-01 | STMicroelectronics | TRANS NPN RF MICROWAVE VHF M113 | Forespørsel |
 |
2SC5007-A | CEL | RF TRANSISTOR NPN SOT-523 | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers