Kjøpe SDURD860TR med BYCHPS
Kjøp med garanti
SDURD860TR
- Delenummer:
- SDURD860TR
- Beskrivelse:
- DIODE GEN PURP 600V DPAK
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 16591 Pieces
- Dataark:
- SDURD860TR.pdf
Introduksjon
BYCHIPS er strømprodusenten for SDURD860TR, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SDURD860TR via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Videresend (Vf) (Maks) @ Hvis: | 1.7V @ 8A |
|---|---|
| Spenning - DC-omvendt (Vr) (Maks): | 600V |
| Leverandør Enhetspakke: | DPAK |
| Hastighet: | Fast Recovery = 200mA (Io) |
| Serie: | - |
| Omvendt gjenopprettingstid (trr): | 50ns |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Andre navn: | 1655-1579-2 |
| Driftstemperatur - Kobling: | -55°C ~ 150°C |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 6 Weeks |
| Produsentens varenummer: | SDURD860TR |
| Utvidet beskrivelse: | Diode Standard 600V Surface Mount DPAK |
| Diodetype: | Standard |
| Beskrivelse: | DIODE GEN PURP 600V DPAK |
| Strøm - Omvendt lekkasje @ Vr: | 8µA @ 600V |
| Gjeldende - Gjennomsnittlig Rectified (Io): | - |
| Kapasitans @ Vr, F: | - |
| Email: | [email protected] |
Beslektede deler til SDURD860TR
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers