Kjøpe SG314 med BYCHPS
Kjøp med garanti
SG314
- Delenummer:
- SG314
- Produsent:
- Ametherm
- Beskrivelse:
- ICL 10 OHM 15% 6A 12.7MM
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 12394 Pieces
- Dataark:
- 1.SG314.pdf2.SG314.pdf
Introduksjon
BYCHIPS er strømprodusenten for SG314, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SG314 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Toleranse: | ±15% |
|---|---|
| Serie: | SURGE-GARD™ |
| R @ Current: | 0.15 Ohm |
| R 25 ° C: | 10 Ohm |
| emballasje: | Bulk |
| Andre navn: | 570-1170 |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 10 Weeks |
| Produsentens varenummer: | SG314 |
| Lead Spacing: | 0.350" (8.89mm) |
| Utvidet beskrivelse: | Inrush Current Limiter 10 Ohm Ohm ±15% 0.500" (12.70mm) |
| Diameter: | 0.500" (12.70mm) |
| Beskrivelse: | ICL 10 OHM 15% 6A 12.7MM |
| Strøm - Stabil tilstand Maks: | 6A |
| godkjenninger: | CSA, UL |
| Email: | [email protected] |
Beslektede deler til SG314
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SG313 | Ametherm | ICL 10 OHM 15% 3A 11.4MM | Forespørsel |
 |
B57211P120M301 | EPCOS (TDK) | ICL 12 OHM 20% 4A 13MM | Forespørsel |
|
SG311 | Ametherm | ICL 5 OHM 15% 7A 15.24MM | Forespørsel |
 |
SG312 | Ametherm | ICL 7 OHM 15% 4A 15.24MM | Forespørsel |
 |
CL-11A | Amphenol Advanced Sensors | ICL 0.7 OHM 25% 12A 19.56MM | Forespørsel |
|
SG317 | Ametherm | ICL 120 OHM 15% 3A 23.5MM | Forespørsel |
|
B57211P250M301 | EPCOS (TDK) | ICL 25 OHM 20% 2.5A 13MM | Forespørsel |
|
SG310 | Ametherm | ICL 5 OHM 15% 4A 15.24MM | Forespørsel |
|
SG316 | Ametherm | ICL 40 OHM 15% 2A 15.88MM | Forespørsel |
|
SG315 | Ametherm | ICL 20 OHM 15% 1.75A 12.7MM | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers