Kjøpe SI3008-B-FSR med BYCHPS
Kjøp med garanti
SI3008-B-FSR
- Delenummer:
- SI3008-B-FSR
- Produsent:
- Energy Micro (Silicon Labs)
- Beskrivelse:
- IC ISOMODEM FCC LINE-SIDE 8SOIC
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 13893 Pieces
- Dataark:
- SI3008-B-FSR.pdf
Introduksjon
BYCHIPS er strømprodusenten for SI3008-B-FSR, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SI3008-B-FSR via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Spenning - Forsyning: | - |
|---|---|
| Leverandør Enhetspakke: | 8-SOIC-EP |
| Serie: | ISOmodem® |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | 8-SOIC (0.154", 3.90mm Width) Exposed Pad |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 3 (168 Hours) |
| Produsentens Standard Lead Time: | 8 Weeks |
| Produsentens varenummer: | SI3008-B-FSR |
| Utvidet beskrivelse: | 2.4k Modem V.22, V23, V.32, V.34, V.90, Bell 103, Bell 212A 8-SOIC-EP |
| Beskrivelse: | IC ISOMODEM FCC LINE-SIDE 8SOIC |
| Dataformat: | V.22, V23, V.32, V.34, V.90, Bell 103, Bell 212A |
| Baud priser: | 2.4k |
| Email: | [email protected] |
Beslektede deler til SI3008-B-FSR
| Bilde | Delenummer | produsenter | Beskrivelse | Utsikt |
|---|---|---|---|---|
 |
SI3008-B-FS | Silicon Labs | IC ISOMODEM FCC LINE-SIDE 8SOIC | Forespørsel |
|
SI3000-KS | Silicon Labs | IC VOICE CODEC 3.3V/5V 16SOIC | Forespørsel |
|
SI3000-C-GSR | Silicon Labs | IC VOICE CODEC 3.3V/5V 16SOIC | Forespørsel |
|
SI3008-A-FS | Silicon Labs | IC ISOMODEM FCC LINE-SIDE 8SOIC | Forespørsel |
|
SI3000-C-FS | Silicon Labs | IC VOICE CODEC 3.3V/5V 16SOIC | Forespørsel |
|
SI3015-BS | Silicon Labs | IC ISOMODEM LINE-SIDE DAA 16SOIC | Forespørsel |
|
SI3000-C-GS | Silicon Labs | IC VOICE CODEC 3.3V/5V 16SOIC | Forespørsel |
|
SI3000-C-FSR | Silicon Labs | IC VOICE CODEC 3.3V/5V 16SOIC | Forespørsel |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers