Kjøpe SIA910EDJ-T1-GE3 med BYCHPS
Kjøp med garanti
SIA910EDJ-T1-GE3
- Delenummer:
- SIA910EDJ-T1-GE3
- Produsent:
- Vishay / Siliconix
- Beskrivelse:
- MOSFET 2N-CH 12V 4.5A SC-70-6
- Lead Free Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgjengelig mengde:
- 15099 Pieces
- Dataark:
- SIA910EDJ-T1-GE3.pdf
Introduksjon
BYCHIPS er strømprodusenten for SIA910EDJ-T1-GE3, vi har aksjene for umiddelbar frakt og også tilgjengelig for lang leveringstid. Vennligst send oss din kjøpsplan for SIA910EDJ-T1-GE3 via e-post, vil vi gi deg en best pris i henhold til planen din.
spesifikasjoner
| Vgs (th) (Maks) @ Id: | 1V @ 250µA |
|---|---|
| Leverandør Enhetspakke: | PowerPAK® SC-70-6 Dual |
| Serie: | TrenchFET® |
| Rds På (Maks) @ Id, Vgs: | 28 mOhm @ 5.2A, 4.5V |
| Strøm - Maks: | 7.8W |
| emballasje: | Tape & Reel (TR) |
| Pakke / tilfelle: | PowerPAK® SC-70-6 Dual |
| Andre navn: | SIA910EDJ-T1-GE3TR SIA910EDJT1GE3 |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Vannfølsomhetsnivå (MSL): | 1 (Unlimited) |
| Produsentens Standard Lead Time: | 24 Weeks |
| Produsentens varenummer: | SIA910EDJ-T1-GE3 |
| Inputkapasitans (Ciss) (Maks) @ Vds: | 455pF @ 6V |
| Gateavgift (Qg) (Maks) @ Vgs: | 16nC @ 8V |
| FET Type: | 2 N-Channel (Dual) |
| FET-funksjonen: | Logic Level Gate |
| Utvidet beskrivelse: | Mosfet Array 2 N-Channel (Dual) 12V 4.5A 7.8W Surface Mount PowerPAK® SC-70-6 Dual |
| Drain til Source Voltage (VDSS): | 12V |
| Beskrivelse: | MOSFET 2N-CH 12V 4.5A SC-70-6 |
| Strøm - Kontinuerlig avløp (Id) @ 25 ° C: | 4.5A |
| Email: | [email protected] |
Beslektede deler til SIA910EDJ-T1-GE3
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers